5G Communication
5G is the focus of global attention nowadays. In equipment manufacturing and application services, core networks, base stations, transmission devices, network terminals, and smartphone devices are all closely related to thermal control technologies. Therefore, introducing thermal components improves device reliability and data transfer performance. TaiSol provides customized services and various thermal solutions to build a smart city with all partners and customers.
Thermal Control Technology for Base Station Equipment
5G base station equipment assembly includes AAU, RRU, antenna, and CU/DU split architecture. The 5G technology develops the CU/DU architecture from the original BBU processing to achieve low latency and high network speed. RRU can be categorized into AAU of O-RAN and RU of NON-O-RAN based on protocols.
O-RAN (Open Radio Access Network) is a novel network architecture paradigm in which the mobile network comprises hardware and software systems from multiple vendors. These components operate through an “open and interoperable” network interface.

BBU Heat Sink
AAU Heat Sink
RU Heat Sink
INTEL X86

CPU Architecture | Intel X86 |
Cooler Size | 164 * 205 * 22 mm |
TDP | 60 W |
INTEL X86

CPU Architecture | Intel X86 |
Cooler Size | 164 * 205 * 22 mm |
TDP | 60 W |
EDGE Heat Sink

EDGE Heat Sink

Heat Source | NX (Nvidia Xavier) Module、5G、WIFI 、SSD,There are 28 heat sources in total.. |
Cooler Size | 164 * 205 * 22 mm |
Optical Module Heat Sink
EMI Shielding Conductive Adhesive Dispensing
TaiSol provides the dispensing service of EMI shielding conductive adhesive using high-precision automated equipment to apply the exact amount of conductive adhesive to the required shielding path on the product’s surface at a fixed speed. After solidifying, the conductive or non-conductive sealing liner can meet the EMI shielding and environmental sealing requirements.