桌上型電腦
泰碩擁有豐富的高效能散熱模組設計經驗,由熱管、散熱鰭片及風扇,組合設計一個具有高散熱效率,又有成本競爭力的模組產品。
INTEL LGA115x / AMD AM4

Description | HeatSink + Fan + Backplate |
Cooler Size | 95 * 95 * 58.4 mm |
HS Loading | 40 – 50 lbf |
TDP | 65 W |
INTEL LGA115x / AMD AM4

Description | HeatSink + Fan + Fan Duct |
Cooler Size | 147 * 105 * 61.8 mm |
HS Loading | 40 – 50 lbf |
TDP | 65 W |
INTEL LGA115x / AMD AM4

Description | Base + Fin + HeatPipe + Fan + Fan Holder |
Cooler Size | 116 * 102.5 * 78.9 mm |
HS Loading | 40 – 50 lbf |
TDP | 95 W |
筆記型電腦
泰碩同時具備熱管及均溫板之研發設計與製程能力,能快速為客戶提供完整且多元的散熱解決方案。
熱管款式
INTEL CPU Architecture

Description | Plate + Fin + HeatPipe + Fan |
Cooler Size | 254 * 100 * 3.9 mm |
HS Loading | CPU 9 – 10 lbf GPU 8 – 9 lbf |
TDP | CPU + GPU : 25 W + 25W |
INTEL CPU Architecture

Description | Plate + Fin + HeatPipe |
Cooler Size | 290 * 94 * 11.4 mm |
HS Loading | CPU 9 – 10 lbf GPU 8 – 9 lbf |
TDP | CPU + GPU : 45 W + 40W |
INTEL CPU Architecture

Description | Base + Fin + HeatPipe + Diecasting |
Cooler Size | 350 * 144 * 43 mm |
HS Loading | CPU 9 – 10 lbf GPU 8 – 9 lbf |
TDP | CPU + GPU : 60 W + 100W |
均溫板款式
AMD CPU Architecture

Description | Base + Fin + VC + Fan + Diecasting |
Cooler Size | 352 * 142 * 14.6 mm |
HS Loading | CPU 11 – 13.2 lbf GPU 12.1 – 14.3 lbf |
TDP | CPU + GPU : 50 W + 150W |
AIO電腦
隨著使用者習慣的改變,體積輕巧與安裝簡易的AIO電腦成為空間不足與追求簡潔單純之消費者的選項。泰碩以卓越的設計在有限空間下最大化散熱效率。
INTEL CPU Architecture

Description | Fin + HeatPipe + Plate |
HS Loading | CPU 10 kgf , VGA 2.8 kgf |
TDP | CPU : 65 W , VGA : 50W |
INTEL CPU Architecture

Description | Base + Fin + HeatPipe + Block |
HS Loading | CPU 3.5 kgf |
TDP | CPU : 70 W |
INTEL CPU Architecture

Description | Base + Fin + VC + Block |
HS Loading | CPU 3.5 kgf , VGA 3.0 kgf |
TDP | CPU : 55 W , VGA : 70W |