伺服器
近年來大數據、人工智慧以及雲服務的興起,伺服器及大型資料中心的需求不斷增長。泰碩的專業客製化熱管理能力解決了伺服器所訴求之節能、高穩定性與可靠性,獲得多方客戶高度認可,以精湛技術及尖端效能獲取更多的整合價值及市場領域。
液冷方案
液冷散熱系統利用泵使散熱管中的冷卻液循環並進行散熱。通常由 : 循環液、水泵、管道和水箱或換熱器組成,與普通風冷散熱相比,水冷散熱具有低噪音、散熱快等優點。
泰碩液冷散熱器現廣泛應用於服務器、 通訊5G/4G LTE、投影機等領域。
Whitley 1U Liquid Cooling (Closed Loop)
CPU Architecture | Whitley |
Socket | LGA4189 |
Cooler Size | 350 * 217.75 * 40.0 mm |
HS Loading | 168 ~ 350 lbf |
TDP | 165 W |
Liquid Cooling (Open Loop)
CPU Architecture | Whitley |
Socket | LGA4189 |
Cooler Size | 108 * 78 * 22.9 mm |
HS Loading | 215 ~ 320 lbf |
TDP | 230 W |
氣冷方案
Purley 1U Narrow
CPU Architecture | SKX (Skylake) |
Socket | LGA3647-P0 |
Cooler Size | 108 * 78 * 25.5 mm |
HS Loading | 200 ~ 300 lbf |
TDP | 205 W |
Purley 2U Narrow
CPU Architecture | SKX ( Skylake ) |
Socket | LGA3647-P0 |
Cooler Size | 108 * 78 * 64 mm |
HS Loading | 200 ~ 300 lbf |
TDP | 165 W |
Purley 2U Narrow
CPU Architecture | SKX (Skylake) |
Socket | LGA3647-P0 |
Cooler Size | 108 * 79.8 * 63.8 mm |
HS Loading | 200 ~ 300 lbf |
TDP | 145 W |
Purley 3U Narrow
CPU Architecture | SKX (Skylake) |
Socket | LGA3647-P0 |
Cooler Size | 91 * 88 * 119.55 mm |
HS Loading | 200 ~ 300 lbf |
TDP | 120 W |
Whitley 1U
CPU Architecture | ICX ( Icelake ) |
Socket | LGA4189-P4 |
Cooler Size | 113 * 78 * 24.7 mm |
HS Loading | Max. 350 lbf |
TDP | 165 W |
Whitley 2U
CPU Architecture | ICX ( Icelake ) |
Socket | LGA4189-P4 |
Cooler Size | 113 * 78 * 64 mm |
HS Loading | Max. 350 lbf |
TDP | 250 W |
Whitley 3U
CPU Architecture | ICX ( Icelake ) |
Socket | LGA4189-P4 |
Cooler Size | 113 * 78 * 100 mm |
HS Loading | Max. 350 lbf |
TDP | 250 W |
Eaglestream 1U
CPU Architecture | Sapphire Rapids ( SPR ) |
Socket | LGA4677 |
Cooler Size | 118 * 78 * 24.7 mm |
HS Loading | Max. 350 lbf |
TDP | 170 W |
Roma、Milan 1U
CPU Architecture | EPYC |
Socket | OLGA4094-SP3 |
Cooler Size | 119 * 78.6 * 24.8 mm |
HS Loading | 75 lbf |
TDP | 200 W |
Roma、Milan 2U
CPU Architecture | EPYC |
Socket | OLGA4094-SP3 |
Cooler Size | 119.3 * 78.6 * 64 mm |
HS Loading | 75 lbf |
TDP | 200 W |
Genoa 2U
CPU Architecture | EPYC |
Socket | LGA6096-SP5 |
Cooler Size | 118 * 94.2 * 63.7 mm |
HS Loading | 140 – 175 kgf |
TDP | 155 W |
Genoa 2U
CPU Architecture | EPYC |
Socket | LGA6096-SP5 |
Cooler Size | 118 * 92.4 * 64 mm |
HS Loading | 140 – 175 kgf |
TDP | 320 W |