Desktop PC
Experienced in designing high-performance thermal modules, TaiSol provides a highly efficient and cost-competitive module by combining heat pipes, cooling fins, and fans.
INTEL LGA115x / AMD AM4

Description | HeatSink + Fan + Backplate |
Cooler Size | 95 * 95 * 58.4 mm |
HS Loading | 40 – 50 lbf |
TDP | 65 W |
INTEL LGA115x / AMD AM4

Description | HeatSink + Fan + Fan Duct |
Cooler Size | 147 * 105 * 61.8 mm |
HS Loading | 40 – 50 lbf |
TDP | 65 W |
INTEL LGA115x / AMD AM4

Description | Base + Fin + HeatPipe + Fan + Fan Holder |
Cooler Size | 116 * 102.5 * 78.9 mm |
HS Loading | 40 – 50 lbf |
TDP | 95 W |
Notebook
With the change in user habits, compact and easy-to-install AIO computers have become the best choice for consumers who need more space and want to keep things simple. TaiSol’s exceptional design maximizes cooling efficiency in limited space.
Heat Pipes Model
INTEL CPU Architecture

Description | Plate + Fin + HeatPipe + Fan |
Cooler Size | 254 * 100 * 3.9 mm |
HS Loading | CPU 9 – 10 lbf GPU 8 – 9 lbf |
TDP | CPU + GPU : 25 W + 25W |
INTEL CPU Architecture

Description | Plate + Fin + HeatPipe |
Cooler Size | 290 * 94 * 11.4 mm |
HS Loading | CPU 9 – 10 lbf GPU 8 – 9 lbf |
TDP | CPU + GPU : 45 W + 40W |
INTEL CPU Architecture

Description | Base + Fin + HeatPipe + Diecasting |
Cooler Size | 350 * 144 * 43 mm |
HS Loading | CPU 9 – 10 lbf GPU 8 – 9 lbf |
TDP | CPU + GPU : 60 W + 100W |
Vapor Chamber Model
AMD CPU Architecture

Description | Base + Fin + VC + Fan + Diecasting |
Cooler Size | 352 * 142 * 14.6 mm |
HS Loading | CPU 11 – 13.2 lbf GPU 12.1 – 14.3 lbf |
TDP | CPU + GPU : 50 W + 150W |
AIO
With the change in user habits, compact and easy-to-install AIO computers have become the best choice for consumers who need more space and want to keep things simple. TaiSol’s exceptional design maximizes cooling efficiency in limited space.
INTEL CPU Architecture

Description | Fin + HeatPipe + Plate |
HS Loading | CPU 10 kgf , VGA 2.8 kgf |
TDP | CPU : 65 W , VGA : 50W |
INTEL CPU Architecture

Description | Base + Fin + HeatPipe + Block |
HS Loading | CPU 3.5 kgf |
TDP | CPU : 70 W |
INTEL CPU Architecture

Description | Base + Fin + VC + Block |
HS Loading | CPU 3.5 kgf , VGA 3.0 kgf |
TDP | CPU : 55 W , VGA : 70W |