Server
With the recent surge of big data, AI, and cloud services, the demand for servers and large data centers has been rising. The highly recognized, professional, and customized thermal solutions of TaiSol can satisfy the need for energy saving, high stability, and reliability of servers. With outstanding technology and cutting-edge performances, TaiSol aims to achieve greater integration values and broader markets.
Liquid Cooling
A liquid cooling system uses a pump to circulate the coolant in heat pipes to achieve heat dissipation. These systems usually consist of circulating liquids, pumps, pipes, and tanks or heat exchangers. Compared with traditional air cooling, water cooling has lower noise and achieves faster heat dissipation.
TaiSol’s liquid coolers are widely used in servers, 5G/4G LTE, projectors, and other fields.
Cold plate For Liquid Cooling
| CPU Architecture | AMD SP5 Genoa / Turin |
| Socket | OLGA6096 |
| Cooler Size | 118 * 92.4 * 24.0 mm (1U) 118 * 92.4 * 37.0 mm (1.5U) |
| HS Loading | 140 ~ 175 lbf |
| TDP | 350 ~ 500 W |
Multi-Liquid Cooling Module (Open Loop)
| CPU Architecture | Intel EGS / AMD SP5 Genoa |
| Socket | OLGA6096 |
| Cooler Size | 405 * 240 * 25.0 mm |
| HS Loading | 140 ~ 175 lbf |
| TDP | 400W * pcs + DIMM + VR |
Liquid Cooling Module (Open Loop)
| CPU Architecture | Intel EGS / BHS-SP |
| Socket | LGA4677 |
| Cooler Size | 118 * 78 * 24.0 mm (1U) |
| HS Loading | Max 350 lbf |
| TDP | 400 W * 2pcs |
Cold plate For Liquid Cooling
| CPU Architecture | Intel EGS / BHS-SP |
| Socket | LGA4677 |
| Cooler Size | 118 * 78 * 24.0 mm (1U) 118 * 78 * 37.0 mm (1.5U) |
| HS Loading | Max 350 lbf |
| TDP | 350 ~ 500 W |
Whitley 1U Liquid Cooling (Closed Loop)
| CPU Architecture | Whitley |
| Socket | LGA4189 |
| Cooler Size | 350 * 217.75 * 40.0 mm |
| HS Loading | 168 ~ 350 lbf |
| TDP | 165 W |
Liquid Cooling (Open Loop)
| CPU Architecture | Whitley |
| Socket | LGA4189 |
| Cooler Size | 108 * 78 * 22.9 mm |
| HS Loading | 215 ~ 320 lbf |
| TDP | 230 W |
Air Cooling
Purley 1U Narrow
| CPU Architecture | SKX (Skylake) |
| Socket | LGA3647-P0 |
| Cooler Size | 108 * 78 * 25.5 mm |
| HS Loading | 200 ~ 300 lbf |
| TDP | 205 W |
Purley 2U Narrow
| CPU Architecture | SKX ( Skylake ) |
| Socket | LGA3647-P0 |
| Cooler Size | 108 * 78 * 64 mm |
| HS Loading | 200 ~ 300 lbf |
| TDP | 165 W |
Purley 2U Narrow
| CPU Architecture | SKX (Skylake) |
| Socket | LGA3647-P0 |
| Cooler Size | 108 * 79.8 * 63.8 mm |
| HS Loading | 200 ~ 300 lbf |
| TDP | 145 W |
Purley 3U Narrow
| CPU Architecture | SKX (Skylake) |
| Socket | LGA3647-P0 |
| Cooler Size | 91 * 88 * 119.55 mm |
| HS Loading | 200 ~ 300 lbf |
| TDP | 120 W |
Whitley 1U
| CPU Architecture | ICX ( Icelake ) |
| Socket | LGA4189-P4 |
| Cooler Size | 113 * 78 * 24.7 mm |
| HS Loading | Max. 350 lbf |
| TDP | 165 W |
Whitley 2U
| CPU Architecture | ICX ( Icelake ) |
| Socket | LGA4189-P4 |
| Cooler Size | 113 * 78 * 64 mm |
| HS Loading | Max. 350 lbf |
| TDP | 250 W |
Whitley 3U
| CPU Architecture | ICX ( Icelake ) |
| Socket | LGA4189-P4 |
| Cooler Size | 113 * 78 * 100 mm |
| HS Loading | Max. 350 lbf |
| TDP | 250 W |
Eaglestream 1U
| CPU Architecture | Sapphire Rapids ( SPR ) |
| Socket | LGA4677 |
| Cooler Size | 118 * 78 * 24.7 mm |
| HS Loading | Max. 350 lbf |
| TDP | 170 W |
Roma、Milan 1U
| CPU Architecture | EPYC |
| Socket | OLGA4094-SP3 |
| Cooler Size | 119 * 78.6 * 24.8 mm |
| HS Loading | 75 lbf |
| TDP | 200 W |
Roma、Milan 2U
| CPU Architecture | EPYC |
| Socket | OLGA4094-SP3 |
| Cooler Size | 119.3 * 78.6 * 64 mm |
| HS Loading | 75 lbf |
| TDP | 200 W |
Genoa 2U
| CPU Architecture | EPYC |
| Socket | LGA6096-SP5 |
| Cooler Size | 118 * 94.2 * 63.7 mm |
| HS Loading | 140 – 175 kgf |
| TDP | 155 W |
Genoa 2U
| CPU Architecture | EPYC |
| Socket | LGA6096-SP5 |
| Cooler Size | 118 * 92.4 * 64 mm |
| HS Loading | 140 – 175 kgf |
| TDP | 320 W |