Slim Vapor Chamber
With the advancement of manufacturing technology and the advent of the 5G era, the power per volume for chips has become higher, which makes portable devices such as smartphones and tablets generate more heat.
Therefore, thermal management technology has become one of the critical elements for a product to succeed in the market.
TaiSol developed a thin, tenacious composite material for vapor chambers with customizable profiles, ultra-high thermal conductivity, and a long life cycle, which is the best choice for smartphones and notebooks.
Products
| Application | Mobile Phone |
| Cooler Size | 40.2 * 38.13 * 0.35 mm |
| Heater Size | 10 * 10 mm |
| TDP | 3.5 W |
| Application | Mobile Phone |
| Cooler Size | 39.68 * 33.2 * 0.35 mm |
| Heater Size | 10 * 10 mm |
| TDP | 3.5 W |
| Application | Mobile Phone |
| Cooler Size | 59.45 * 45.49 * 0.35 mm |
| Heater Size | 10 * 10 mm |
| TDP | 3.5 W |
| Application | Mobile Phone |
| Cooler Size | 42.32 * 35.12 * 0.35 mm |
| Heater Size | 9 * 9 mm |
| TDP | 3.5 W |
| Application | Mobile Phone |
| Cooler Size | 57.58 * 47.14 * 0.3 mm |
| Heater Size | 10 * 10 mm |
| TDP | 3.5 W |
| Application | Mobile Phone |
| Cooler Size | 55.22 * 48.88 * 0.35 mm |
| Heater Size | 10 * 10 mm |
| TDP | 3 W |