Standard Vapor Chamber

Since high-power (above 300W) applications have increased dramatically due to the demands of GPUs and communication, thick vapor chambers have become necessary to provide high-efficiency heat dispersion.

Many applications nowadays have load designs that require high power within a short time. The excellent temperature equalization ability and high thermal conductivity of vapor chambers can meet the demand of such applications where instantaneous high power generates a significant amount of heat.

TaiSol can provides a customizable lug boss design for vapor chambers that maximize space utilization to avoid interference due to densely distributed components around the heat source.

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